El láser de nanosegundos está disponible, nació otra herramienta de corte por láser FPC

Con el mayor desarrollo del mercado 3C, los productos electrónicos tienden hacia la miniaturización y la inteligencia. La placa de circuito flexible FPC, que es un componente importante y un soporte de conexión de circuito, se vuelve cada vez más delgada y los componentes que aloja se vuelven cada vez más densos. Estas tendencias requieren una precisión de procesamiento cada vez mayor.

Con las ventajas únicas de los láseres UV, los láseres UV se utilizan cada vez más en el corte FPC y están reemplazando gradualmente el proceso tradicional de corte FPC.

Desventajas del proceso de corte tradicional

El procesamiento FPC tradicional de placas de circuitos flexibles adopta métodos como troquelado y estampado. Este tipo de procesamiento trae desventajas visibles. En primer lugar, el proceso de subplaca de contacto mecánico es propenso a la deformación, rebabas e incluso daños al elemento bajo la acción de la tensión externa. La segunda es que la precisión no es alta y ya no es aplicable a algunos FPC de alta precisión, lo que probablemente cause bajos rendimientos; la tercera es que algunos materiales FPC de forma personalizada no se pueden procesar de manera eficiente.

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The cutting results of CO2 infrared lasers are also unsatisfactory, because a large heat-affected area is easily generated during the cutting process, which interferes with the cutting accuracy, and even causes scorching and deformation, uneven incision and poor quality.

If the industrial-grade nanosecond solid-state laser developed by RFH is used, it can bring very good processing effects. The central wavelength of 355nm ultraviolet laser can be selected, and the beam quality is high, which can well solve the above problems.

First of all, the 355nm UV laser has high single-photon energy and small pulse width (<20ns), resulting in low thermal effect and not easy to burn, especially for PI film and release paper that are sensitive to thermal effects in FPC materials , the advantages of UV laser cold processing are obvious;

Secondly, compared with traditional mechanical processing, laser processing does not have direct contact, does not generate mechanical force, causes little damage to materials, and can also process specific graphics with high processing efficiency;

Again, this industrial-grade nanosecond solid-state laser has excellent beam quality (M2 < 1.2), and the focused spot diameter is as low as micron, resulting in a narrow incision width and smooth incision edges, so the density of circuit components can be maximized. Fully exploit the potential of the circuit board;

In addition, the use of laser processing does not require any consumables, and the processing speed is fast. While FPC is cutting, it can also assist in marking, which is helpful for product supervision or traceability.

In fact, this industrial-grade nanosecond solid-state laser developed and designed by RFH can not only be used for FPC cutting, but also can be used for precision micromachining of thin, brittle and other metal and non-metallic materials, such as PCB board cutting, drilling Holes, glass, sapphire cutting, etc., the scope of application is very wide, convenient for users to use flexibly.