Material de antena y película LCP de corte por láser verde de 15 W con alta precisión

LCP es un nuevo tipo de material polimérico, conocido como el "material clave para ahogar la garganta de 5G", y se usa ampliamente en el campo de la electrónica 3C. Al comienzo de su desarrollo, los materiales resistentes a altas temperaturas se usaban a menudo en los hornos de microondas. Con el desarrollo de la tecnología y la expansión de los campos de aplicación, el LCP se ha incorporado gradualmente a las personas debido a su resistencia a altas temperaturas, propiedades mecánicas de alta resistencia, propiedades eléctricas superiores y propiedades de procesamiento. El campo de visión se está aplicando gradualmente a la aplicación científica de 5G.

Película LCP, proceso de corte por láser de material de antena

uv laser | green laser | Ultraviolet lasers | uv dpss laser | nanosecond laser | UV laser source | Solid State Lasers

Common LCP products include electronic component connectors, antenna materials, production connection tubes and sensors, etc., which are widely used. With the advent of the 5G era, LCP as an antenna material has greatly increased the demand. Xiaobian today introduces a LCP material cutting equipment-laser cutting machine. In the 3C field, the cutting requirements for LCP are relatively high, and traditional cutting methods have gradually been unable to meet the increasing technological requirements. In order to seek the most technological progress, LCP laser cutting machine has entered people's field of vision and replaced the traditional cutting method.

What are the advantages of LCP green laser cutting machine cutting?

1. Non-contact processing: In laser processing, only the laser beam is in contact with the processed part, and no cutting force acts on the cut part to avoid damage to the surface of the processed material.

2. High processing accuracy and low heat influence: Pulsed laser can achieve extremely high instantaneous power, extremely high energy density and low average power, and can complete processing instantly with extremely small heat-affected area, ensuring high-precision processing and small heat-affected area .

3. High processing efficiency and good economic benefits: laser processing efficiency is often several times that of mechanical processing, and there is no consumables and pollution. The laser stealth cutting technology of semiconductor wafers is a brand-new laser cutting process, which has many advantages such as fast cutting speed, no dust generated during cutting, no loss of cutting substrate, small cutting path required, and complete dry process.