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laser uv 355 nm for Precision hole drilling in Silicon Wafers
Nov 30 , 2021laser uv 355 nm for Precision hole drilling in Silicon Wafers
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thin film solar cells and modules and we are looking to acquire a UV laser for module scribing and drilling in Silicon Wafers.The laser would need to cut the foil in a manner in order not to impact the quality of the foil on the cut edge (no debris, no oxidation, no heat transfer)
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