D9 UV Laser: Damage-Free Laser Stripping Solution for Ultra-Fine Enameled Copper Wire

The processing of ultra-fine enameled copper wire is always a tough challenge in microelectronics manufacturing. Traditional mechanical stripping tools often exert physical force on the tiny wire core, which easily causes copper wire breakage, conductor deformation, burrs or hidden cracks, directly raising the scrap rate of micro coils, medical leads, sensor windings and wearable electronic assemblies.

Our D9 UV laser brings a reliable non-contact stripping method based on cold photon ablation. Instead of melting the material through heat, the UV laser precisely breaks the molecular bond of the enamel insulation layer, vaporizing the coating cleanly without touching the delicate copper core.

This technology features micron-level positioning accuracy and an extremely small heat-affected zone. It leaves no residual enamel, avoids copper oxidation, and maintains the original mechanical and conductive performance of ultra-fine copper wire. It supports stable, repeatable stripping for mass production, even for wires with an ultra-small diameter that cannot be handled by mechanical stripping equipment.

Whether you are producing miniature electromagnetic coils, implantable medical wiring, optical sensing components or high-density electronic modules, the D9 UV UV laser delivers consistent stripping quality to help you reduce waste and improve production yield.

We welcome you to send your wire samples for free laser process testing. Let’s explore optimized UV laser processing solutions for your precision manufacturing projects.