Briefly describe the application of 15W high power ultraviolet laser cutting machine in high-end industry

At present, with the gradual maturity and stability of ultraviolet lasers, the laser processing industry has shifted from infrared lasers to ultraviolet lasers. At the same time, the application of ultraviolet lasers is becoming more and more popular, and laser applications are moving towards a broader field.

Nanosecond UV Laser Cutting Machine

The working principle of the UV laser cutting machine is UV laser wafer cutting. The surface of the sapphire substrate is hard. Generally, the cutter wheel is difficult to cut, and the wear is large, the yield is low, and the cutting path is larger than 30 μm, which not only reduces the use area, And it reduces the output of the product. Driven by the blue and white LED industry, the demand for sapphire substrate wafer cutting has increased greatly, and higher requirements have been put forward for improving productivity and finished product qualification rate.

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Ultraviolet laser processing has become a necessary processing method, which can process many types of ceramics

Ultraviolet laser uses ceramic cutting. In the last century, the application of electronic ceramics has gradually matured, with a wider range of applications, such as heat dissipation substrates, piezoelectric materials, resistors, semiconductor applications, biological applications, etc. In addition to traditional ceramic processing technology, ceramic processing is also due to applications The increase in types, and then entered the field of laser processing. According to the types of ceramic materials, it can be divided into functional ceramics, structural ceramics and bio-ceramics. Lasers that can be used to process ceramics include CO2 lasers, YAG lasers, green lasers, etc. However, with the gradual miniaturization of components, ultraviolet laser processing has become a necessary processing method, which can process many types of ceramics.

UV laser has developed a variety of applications in the mobile phone industry

Ultraviolet laser glass cutting, and the application of ultraviolet laser, driven by the rise of smart phones, gradually has room for development. In the past, because mobile phones did not have many functions and the cost of laser processing was high, laser processing did not occupy much position in the mobile phone market. However, smart phones now have many functions and are highly integrated. It is necessary to integrate data in a limited space. Ten kinds of sensors and hundreds of functional devices, and the high cost of components, so the accuracy, yield, and processing requirements have greatly increased, and ultraviolet lasers have developed a variety of applications in the mobile phone industry.

The UV laser cutting machine uses UV laser ITO dry etching

La máquina de corte por láser UV utiliza grabado en seco ITO con láser UV. La característica más importante del teléfono inteligente es la función de la pantalla táctil. La pantalla táctil capacitiva puede lograr multi-touch. Correspondiente a la pantalla táctil resistiva, tiene una vida más larga y una respuesta más rápida. Las pantallas táctiles capacitivas se han convertido en la opción principal para los teléfonos inteligentes. Esto es actualmente popular en nuestra sociedad actual, y también es una aplicación popular.

La placa de circuito se cortó con láser y se utilizó por primera vez para el corte de placa de circuito flexible

El corte de placa de circuito con láser ultravioleta, el corte de placa de circuito con láser se utilizó por primera vez para el corte de placa de circuito flexible. Debido a que hay muchos tipos de placas de circuito, el procesamiento inicial se realiza mediante la formación de moldes, pero el costo de producción de los moldes es alto y el ciclo de producción es largo, por lo que se utilizan láseres ultravioleta. El procesamiento puede eliminar el costo y el ciclo de fabricación de moldes y aumentar considerablemente el tiempo de fabricación de muestras. Esto no solo mejorará nuestra fuerza de trabajo actual y nuestra eficiencia laboral.